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基于压电技术的微点胶系统

MDS 3280系列

  • 适合高粘度介质（最高粘度可至2,000,000 毫帕.秒）
  • 独创快拆液盒，带集成加热块
  • 易于操作，便于清洁
  • 极度精准的高速点胶
  • 可嵌入各种狭小空间
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MDS 3250+FC系列

  • 带顶部校准，可快速调整参数
  • 基于压电技术的高速点胶系统
  • 精准、可重复的点胶结果
  • 非接触式点胶
  • 极度灵活的应用
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MDS 3200+系列

  • 中至高粘度工业应用
  • 基于压电技术的超精准点胶
  • 产品设计符合生产需求
  • 应用范围广泛
  • 品质久经测试
  • 降低用户成本
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微喷射点胶系统 MDS 3280 Series
微喷射点胶系统 - MDS 3250+FC Series
微喷射点胶系统 MDS 3050 Series
微喷射点胶系统 MDS 1560 Series
DST Powered Hot Melt Dispensing System
焊锡膏微点胶

下载我们的产品宣传页 - 微密斯微喷射点胶系统

微密斯点胶科技收购Lerner Systems公司
VERMES Microdispensing 在美国中西部新设分公司
微密斯点胶科技发布高性能热熔胶方案
VERMES Microdispensing introduces new high frequency series
VERMES Microdispensing突破性全新高速点胶方案，刷新高速极限
VERMES Microdispensing unveils revolutionary Dynamic Shockwave Technology (DST)
VERMES Microdispensing announces expansion in East Asia
VERMES Medical Equipment introduces new product line
VERMES Group moves into new headquarters
VERMES Medical Equipment engages in European Development Project
VERMES Microdispensing presents its modular, highly flexible dispensing solution MDS 3280

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VERMES Microdispensing
Corporate Overview
Solder Paste Dispensing Perfection
Powered by DST - Dynamic Shockwave Technology
with MDS 1560 System
Hot Melt dispensing application with the DST powered MDS 1560 Hotmelt system
Micro Dispensing System -MDS 3280
Ultra-precise, contact-free dispensing with
high speed Piezo technology
Solder paste dispensing with MDS 1560 system
Hot Melt Dispensing System
Designed for all types of hot glue adhesive applications

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Terms and Conditions
ISO 9001
General Terms & Conditions (AGBs)