“The advantages of the VERMES Microdispensing System MDS 1560 that is based on our revolutionary actuator principle technology - DST (Dynamic Shockwave Technology) combined with GENMA winDot solder paste provide our customers with optimal solder paste dispensing results even at the smallest drop size,” adds Juergen Staedtler, CEO of VERMES Microdispensing.

The VERMES Microdispensing System MDS 1560 can easily be integrated into in numerous machine platforms, such as dispensing robots and screen printers.

High-end design and increased functionalities require electronics to get continuously smaller. The new VERMES MDS 1560 system with its optimized dispensing characteristics in combination with GENMA’s winDot solder paste allows jetting small dots in an absolutely reliable process at a high speed. Besides speed and dot size, reliability is specifically important. The new jetting process offers a solution that provides continuous top results. The valve can jet more than 1 million dots in a row without the necessity of operator attention.

In electronics manufacturing, the solution easily performs solder paste dispensing of smallest dot sizes and can increase the density on boards. The GENMA winDot solder paste can be jetted to pads for the smallest chip component currently in use, which is known as a 01005.

In prototyping and small-scale production the VERMES Microdispensing System MDS 1560 in combination with the GENMA winDot solder paste is much more productive than stencil printing.

In mass production, the solution is an ideal addition to filling up solder depots or add additional depots.

Where it is not possible to print small solder paste depots, such as with flexible PCBs and 3D-MIDs (3-Dimensional Molded Interconnected Devices production), the system solution offers the fastest and most precise way of applying solder paste.

Without doubt, the jetting technology is sustainably faster than needle dispensing and pin transfer and delivers more precise results.

The higher accuracy considerably increases the production yield compared to the currently used solder paste application methods. A small dot size combined with highest reliability and high speed also provide great advantages to module packaging, such as PoP (Package on Package) modules, CSP (Chip Scale Packages) modules , 3D printed circuit boards, and for mounting RF Shields.